Roles and Responsibilities:
Responsible for architecting moderately complex avionic computer hardware systems that include both digital and analog components.
Maintain specialized knowledge in semiconductor processors, System-on-Chip, and FPGA component architectures.
Have In-depth knowledge of hardware design best practices and integration with electronics manufacturing; have working knowledge of competition and the factors that differentiate them in the market.
Participation in hardware design architectural trade studies, reviews and proposals.
Uses judgment to make decisions or solve moderately complex tasks or problems in hardware design, manufacturing, or technology.
Takes new perspective on existing solutions.
Uses technical experience and expertise for data analysis to support recommendations.
Uses multiple internal and limited external sources outside of own function to arrive at decisions.
Acts as a resource for colleagues with less experience.
May lead small projects with moderate risks and resource requirements.
Explains difficult or sensitive information; works to build consensus.
Developing persuasion skills required to influence others on topics within field.
Required Qualifications:
Bachelor's degree from an accredited university/college in Electrical or Computer Engineering with 8+ years of professional experiences in design.
Eligibility Requirement (s):
This role requires use of technical data subject to U.S. Government contract restrictions and this posting is only for U.S. Citizens. GE will require proof of status prior to employment.
Desired Characteristics:
Master’s degree in Electrical Engineering with 15+ years of professional experience in digital design.
Proven history of architecting complex digital hardware.
Knowledge of board level digital design process from schematic capture, implementation, integration, and verification.
Experience designing with Gigahertz microprocessors, FPGA, CPLD, DDR4 memory, flash memory.
Experience with large pin count devices, 1000+ pins with 0.8mm device pitch or smaller
Experience in High Density Interconnect (HDI) technologies (micro vias, buried / blind vias, back drilling) for IPC Class 3 board.
Experience in design of 5+ Gbps serial links. (10GBASE-KR, PCIe Gen3, Fiber Optics)
Experience designing with CAN, MIL-STD-1553, ARINC 429, ARINC 664, TSN.
Experience with OpenVPX and PIC-SIG standards.
Experience in the Mil/Aero/avionics, DO-254 and Civil FFA Certification.
Strong professional technical writing and technical communication proficiency.
Ability to break down complex problems and apply critical thinking.
Familiarity with the Mentor Graphics Expedition Enterprise and Hyperlinx PI/SI.
Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, Microsoft Visio.